The layout of heat dissipation holes in a thin-plate metal power supply enclosure is a core design element affecting equipment temperature rise control, impacting key aspects such as airflow organization, heat exchange efficiency improvement, and thermal stress distribution optimization. A well-designed heat dissipation hole layout not only effectively reduces the operating temperature of internal components but also prevents performance degradation or material failure caused by localized overheating, thus ensuring the long-term stable operation of the power system.
The guiding effect of the heat dissipation hole layout on airflow directly affects heat exchange efficiency. The thin-plate metal power supply enclosure uses heat dissipation holes to form air inlets and outlets, creating airflow channels for natural or forced convection. When the heat dissipation holes are located directly above or to the side of high-temperature components, the natural convection formed by rising hot air accelerates heat dissipation. If combined with a fan to create forced convection, the layout of the heat dissipation holes must match the airflow direction to avoid eddies or airflow short-circuiting. For example, designing the air inlet in a low-temperature area and the air outlet in a high-temperature area creates a unidirectional airflow path, making internal air circulation more efficient and significantly improving heat dissipation.
The shape and size of the heat dissipation holes have a decisive influence on thermal resistance control. Circular ventilation holes are commonly used in conventional heat dissipation scenarios due to their simple manufacturing process and uniform stress distribution. Elliptical or elongated ventilation holes, on the other hand, can increase the effective heat dissipation area, thereby improving the heat exchange capacity per unit area. Furthermore, the edge spacing design of the ventilation holes must avoid localized strength reduction in the thin metal plate due to excessively small hole spacing, or the formation of thermal resistance barriers due to excessively large hole spacing. By optimizing the matching relationship between hole diameter and hole spacing, heat dissipation efficiency can be maximized while ensuring structural strength.
The distribution density of ventilation holes needs to be dynamically adapted to the distribution of internal heat sources. The heat generation of internal power supply components is usually uneven; for example, the heat generation of core components such as power transistors and transformers is much higher than that of passive components such as capacitors and inductors. Therefore, the layout of ventilation holes should follow the "heat source orientation" principle, densely arranging ventilation holes in high-temperature areas and reducing the number or diameter of holes in low-temperature areas. This differentiated layout can prevent heat accumulation in local areas and reduce structural strength loss caused by excessive ventilation holes, achieving a balance between heat dissipation and strength.
The arrangement of ventilation holes has a significant impact on temperature uniformity. While regular arrangements (such as matrix arrangements) are simple to manufacture, they easily create fixed resistance points in the airflow path, leading to localized temperature differences. Staggered or gradually changing arrangements, on the other hand, can disrupt the airflow rhythm, reducing resistance concentration and resulting in a more uniform temperature distribution. For example, in a long, narrow power supply enclosure, a gradually increasing aperture arrangement from one end to the other can guide airflow to accelerate gradually along the heat source distribution direction, preventing overheating of front-end components due to insufficient airflow.
The spacing between the heat dissipation holes and internal components must balance heat dissipation and electrical safety. Too close a distance between the heat dissipation holes and heat-generating components, while improving heat exchange efficiency, may lead to localized air ionization due to excessively high component surface temperatures, posing a risk of arcing. Too large a distance increases thermal resistance and reduces heat dissipation. Typically, optimal spacing needs to be determined through thermal simulation analysis, and insulating baffles or thermally conductive pads should be installed inside the power supply enclosure to ensure electrical clearance while improving heat conduction efficiency.
Dustproof and waterproof design of the heat dissipation holes is a key challenge in practical applications. In dusty or humid environments, heat dissipation vents need to incorporate structures such as filters, airflow channels, or angled designs to prevent dust or water droplets from directly entering the interior. For example, a louvered heat dissipation vent structure can ensure airflow while using angled blades to block most dust; the application of a waterproof and breathable membrane can maintain breathability while providing waterproofing, preventing uncontrolled internal temperature rise due to excessive sealing.
The heat dissipation vent layout of thin metal sheet power supply enclosures achieves precise temperature rise control by optimizing airflow, matching heat source distribution, and balancing structural strength and electrical safety. Its design requires comprehensive consideration of thermodynamics, fluid mechanics, and materials mechanics, and continuous iterative optimization through simulation analysis and experimental verification. As power equipment develops towards higher power density and miniaturization, the refined design of heat dissipation vent layouts will become a core means of improving equipment reliability, providing crucial assurance for the long-term stable operation of power systems.
